The communication board pursues high speed, high frequency and other characteristics, with the characteristics of high-speed signal transmission and strong anti-interference ability, to ensure the stability and reliability of communication equipment. In communicationIn the field of PCB, it is widely used in wireless networks, transmission networks, data communication, and fixed broadband. Related products include backboards, high-speed multilayer boards, high-frequency microwave boards, multifunctional metal substrates, etc
Compared to conventionalCompared with materials such as FR-4, high-frequency boards have lower dielectric constant (Dk), smaller dielectric loss factor (Df), better stability, and superior high-frequency signal transmission performance, which are key to ensuring signal integrity, reducing signal delay and loss. This type of material has high TG and poor thermal conductivity. For drilling, the processing difficulties include:
TG is high, and the drill needle is prone to wear and tear
Poor thermal conductivity, high drilling temperature, increased wear of the drilling needle, and easy occurrence of adhesive residue leading to problems with the quality of the hole wall
| Knife shape | Coating | Characteristic |
|---|---|---|
| UCN series | Hard coating/lubricating coati | Has good rigidity and chip removal performance, combined with TAC coating for good thermal conductivity and lubrication |
